Enhance performance, reliability and energy savings
3M has expanded their line of boron nitride cooling fillers applicable to a wide array of automotive, electrical and electronic devices and components.
The new grades from 3M are:
- Boron Nitride Cooling Filler Agglomerates CFA 100
- Boron Nitride Cooling Filler Agglomerates CFA 150
Both consist of soft boron nitride agglomerates used to enhance isotropic thermal conductivity. They provide better through-plane conductivity than platelets or flakes, and their softness helps facilitate low impact on viscosity and easy processing that is less abrasive on equipment.
Boron nitride cooling filler agglomerates from 3M can be added to potting resins, conformable TIM foils or pads and other applications where isotropic thermal conductivity is important. They are also used for bond lines of 150–200 µm (100 grade) and 200 µm or above (150 grade).
